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74HC253; 74HCT253
Dual 4-input multiplexer; 3-state
Rev. 03 -- 22 April 2010 Product data sheet
1. General description
The 74HC253; 74HCT253 are high-speed Si-gate CMOS devices and are pin compatible with Low-power Schottky TTL (LSTTL). The 74HC253; 74HCT253 provides a dual 4-input multiplexer with 3-state outputs which selects 2 bits of data from up to four sources selected by common data select inputs (S0, S1). The two 4-input multiplexer circuits have individual active LOW output enable inputs (1OE, 2OE). The 74HC253 and 74HCT253 are the logic implementation of a 2-pole, 4-position switch, where the position of the switch is determined by the logic levels applied to S0 and S1. The outputs are forced to a high-impedance OFF-state when nOE is HIGH. The logic equations for the outputs are: 1Y = 1OE * ( 1I0 * S1 * S0 + 1I1 * S1 * S0 + 1I2 * S1 * S0 + 1I3 * S1 * S0 ) 2Y = 2OE * ( 2I0 * S1 * S0 + 2I1 * S1 * S0 + 2I2 * S1 * S0 + 2I3 * S1 * S0 )
2. Features and benefits
Non-inverting data path 3-state outputs interface directly with system bus Complies with JEDEC standard no. 7A Common select inputs Separate output enable inputs Input levels: For 74HC253: CMOS level For 74HCT253: TTL level ESD protection: HBM JESD22-A114F exceeds 2000 V MM JESD22-A115-A exceeds 200 V Multiple package options Specified from -40 C to +85 C and from -40 C to +125 C
NXP Semiconductors
74HC253; 74HCT253
Dual 4-input multiplexer; 3-state
3. Applications
Data selectors Data multiplexers
4. Ordering information
Table 1. Ordering information Package Temperature range 74HC253N 74HCT253N 74HC253D 74HCT253D 74HC253DB 74HCT253DB -40 C to +125 C SSOP16 -40 C to +125 C SO16 plastic small outline package; 16 leads; body width 3.9 mm plastic shrink small outline package; 16 leads; body width 5.3 mm SOT109-1 SOT338-1 -40 C to +125 C Name DIP16 Description plastic dual in-line package; 16 leads (300 mil) Version SOT38-4 Type number
5. Functional diagram
1 1OE 1Y
6 5 4 3 6 5 4 3 10 11 12 13 14 2 14 2 1 15 1I0 1I1 1I2 1I3 2I0 2I1 2I2 2I3 S0 S1 1OE 2OE 1Y 7 2Y 9
001aal850
1I0 1I1 1I2 1I3 S0 S1 2I0 2I1 2I2 2I3 MUX MUX
7
10 11 12 13
2Y
9
2OE 15
001aal851
Fig 1.
Logic symbol
Fig 2.
Functional diagram
74HC_HCT253_3
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Product data sheet
Rev. 03 -- 22 April 2010
2 of 17
NXP Semiconductors
74HC253; 74HCT253
Dual 4-input multiplexer; 3-state
1OE
1I3
1I2
1I1
1I0
S0
S1
2I3
2I2
2I1
2I0
2OE
1Y
2Y
001aal852
Fig 3.
Logic diagram
6. Pinning information
6.1 Pinning
74HC253 74HCT253
1OE S1 1I3 1I2 1I1 1I0 1Y GND 1 2 3 4 5 6 7 8
001aal853
16 VCC 15 2OE 14 S0 13 2I3 12 2I2 11 2I1 10 2I0 9 2Y 1OE S1 1l3 1l2 1l1 1l0 1Y GND 1 2 3 4 5 6 7 8
74HC253 74HCT253
16 VCC 15 2OE 14 S0 13 2l3 12 2l2 11 2l1 10 2l0 9
001aal854
2Y
Fig 4.
Pin configuration DIP16, SO16
Fig 5.
Pin configuration SSOP16
74HC_HCT253_3
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Product data sheet
Rev. 03 -- 22 April 2010
3 of 17
NXP Semiconductors
74HC253; 74HCT253
Dual 4-input multiplexer; 3-state
6.2 Pin description
Table 2. Symbol 1OE, 2OE S0, S1 1I0, 1I1, 1I2, 1I3 1Y GND 2Y 2I0, 2I1, 2I2, 2I3 VCC Pin description Pin 1, 15 14, 2 6, 5, 4, 3 7 8 9 10, 11, 12, 13 16 Description output enable inputs (active LOW) data select inputs data inputs source 1 multiplexer output source 1 ground (0 V) multiplexer output source 2 data inputs source 2 supply voltage
7. Functional description
Table 3. S0 X L L H H L L H H
[1]
Function table[1] data inputs S1 X L L L L H H H H nI0 X L H X X X X X X nI1 X X X L H X X X X nI2 X X X X X L H X X nI3 X X X X X X X L H output enable nOE H L L L L L L L L output nY Z L H L H L H L H
select Inputs
H = HIGH voltage level; L = LOW voltage level; X = don't care; Z = high-impedance OFF-state.
8. Limiting values
Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol VCC IIK IOK IO ICC IGND Tstg Parameter supply voltage input clamping current output clamping current output current supply current ground current storage temperature VI < -0.5 V or VI > VCC + 0.5 V VO < -0.5 V or VO > VCC + 0.5 V -0.5 V < VO < VCC + 0.5 V
[1] [1]
Conditions
Min -0.5 -70 -65
Max +7.0 20 50 35 70 +150
Unit V mA mA mA mA mA C
74HC_HCT253_3
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Product data sheet
Rev. 03 -- 22 April 2010
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NXP Semiconductors
74HC253; 74HCT253
Dual 4-input multiplexer; 3-state
Table 4. Limiting values ...continued In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol Ptot Parameter total power dissipation DIP16 package SO16 package SSOP16 package
[1] [2] [3] [4]
Conditions Tamb = -40 C to +125 C
[2] [3] [4]
Min -
Max 750 500 500
Unit mW mW mW
The input and output voltage ratings may be exceeded if the input and output current ratings are observed. Ptot derates linearly with 12 mW/K above 70 C. Ptot derates linearly with 8 mW/K above 70 C. Ptot derates linearly with 5.5 mW/K above 60 C.
9. Recommended operating conditions
Table 5. Recommended operating conditions Voltages are referenced to GND (ground = 0 V) Symbol Parameter VCC VI VO Tamb t/V supply voltage input voltage output voltage ambient temperature input transition rise and fall rate VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V Conditions Min 2.0 0 0 -40 74HC253 Typ 5.0 1.67 Max 6.0 VCC VCC +125 625 139 83 Min 4.5 0 0 -40 74HCT253 Typ 5.0 1.67 Max 5.5 VCC VCC +125 139 V V V C ns/V ns/V ns/V Unit
10. Static characteristics
Table 6. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter 74HC253 VIH HIGH-level input voltage VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V VIL LOW-level input voltage VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V 1.5 3.15 4.2 1.2 2.4 3.2 0.8 2.1 2.8 0.5 1.35 1.8 1.5 3.15 4.2 0.5 1.35 1.8 1.5 3.15 4.2 0.5 1.35 1.8 V V V V V V Conditions Min 25 C Typ Max -40 C to +85 C -40 C to +125 C Unit Min Max Min Max
74HC_HCT253_3
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Product data sheet
Rev. 03 -- 22 April 2010
5 of 17
NXP Semiconductors
74HC253; 74HCT253
Dual 4-input multiplexer; 3-state
Table 6. Static characteristics ...continued At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter VOH HIGH-level output voltage Conditions Min VI = VIH or VIL IO = -20 A; VCC = 2.0 V IO = -20 A; VCC = 4.5 V IO = -20 A; VCC = 6.0 V IO = -6.0 mA; VCC = 4.5 V IO = -7.8 mA; VCC = 6.0 V VOL LOW-level output voltage VI = VIH or VIL IO = 20 A; VCC = 2.0 V IO = 20 A; VCC = 4.5 V IO = 20 A; VCC = 6.0 V IO = 6.0 mA; VCC = 4.5 V IO = 7.8 mA; VCC = 6.0 V II IOZ input leakage current OFF-state output current supply current input capacitance HIGH-level input voltage LOW-level input voltage HIGH-level output voltage VCC = 4.5 V to 5.5 V VCC = 4.5 V to 5.5 V VI = VIH or VIL; VCC = 4.5 V IO = -20 A IO = -6 mA VOL LOW-level output voltage VI = VIH or VIL; VCC = 4.5 V IO = 20 A IO = 6.0 mA II IOZ input leakage current OFF-state output current VI = VCC or GND; VCC = 5.5 V VI = VIH or VIL; VCC = 5.5 V; VO = VCC or GND per input pin; other inputs at VCC or GND; IO = 0 A VI = VCC or GND; IO = 0 A; VCC = 5.5 V 0 0.15 0.1 0.26 0.1 0.5 0.1 0.33 1.0 5.0 0.1 0.4 1.0 10 V V A A 4.4 3.98 4.5 4.32 4.4 3.84 4.4 3.7 V V VI = VCC or GND; VCC = 6.0 V VI = VIH or VIL; VO = VCC or GND; VCC = 6.0 V VI = VCC or GND; IO = 0 A; VCC = 6.0 V 0 0 0 0.15 0.16 0.1 0.1 0.1 0.26 0.26 0.1 0.5 0.1 0.1 0.1 0.33 0.33 1.0 5.0 0.1 0.1 0.1 0.4 0.4 1.0 10.0 V V V V V A A 1.9 4.4 5.9 3.98 5.48 2.0 4.5 6.0 4.32 5.81 1.9 4.4 5.9 3.84 5.34 1.9 4.4 5.9 3.7 5.2 V V V V V 25 C Typ Max -40 C to +85 C -40 C to +125 C Unit Min Max Min Max
ICC CI
-
3.5
8.0 -
-
80
-
160
A pF
74HCT253 VIH VIL VOH 2.0 1.6 1.2 0.8 2.0 0.8 2.0 0.8 V V
ICC
supply current
-
-
8.0
-
80
-
160
A
74HC_HCT253_3
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Product data sheet
Rev. 03 -- 22 April 2010
6 of 17
NXP Semiconductors
74HC253; 74HCT253
Dual 4-input multiplexer; 3-state
Table 6. Static characteristics ...continued At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter ICC additional supply current Conditions Min VI = VCC - 2.1 V; other inputs at VCC or GND; VCC = 4.5 V to 5.5 V; IO = 0 A per input pin; 1In, 2In inputs per input pin; nOE input per input pin; Sn input CI input capacitance 40 110 110 3.5 144 396 396 180 495 495 196 539 539 A A A pF 25 C Typ Max -40 C to +85 C -40 C to +125 C Unit Min Max Min Max
11. Dynamic characteristics
Table 7. Dynamic characteristics Voltages are referenced to GND (ground = 0 V); For test circuit see Figure 8. Symbol Parameter Conditions 25 C Typ 74HC253 tpd propagation delay 1ln to 1Y or 2ln to 2Y; see Figure 6 VCC = 2.0 V VCC = 4.5 V VCC = 5.0 V; CL = 15 pF VCC = 6.0 V Sn to nY; see Figure 6 VCC = 2.0 V VCC = 4.5 V VCC = 5.0 V; CL = 15 pF VCC = 6.0 V ten enable time nOE to nY; see Figure 7 VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V tdis disable time nOE to nY; see Figure 7 VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V
[3] [2] [1]
-40 C to +85 C Max
-40 C to Unit +125 C Max
Max
55 20 17 16 58 21 18 17 30 11 9 41 15 12
175 35 30 175 35 30 100 20 17 150 30 26
220 44 37 220 44 37 125 25 21 190 38 33
265 53 45 265 53 45 150 30 26 225 45 38
ns ns ns ns ns ns ns ns ns ns ns ns ns ns
74HC_HCT253_3
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(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 03 -- 22 April 2010
7 of 17
NXP Semiconductors
74HC253; 74HCT253
Dual 4-input multiplexer; 3-state
Table 7. Dynamic characteristics ...continued Voltages are referenced to GND (ground = 0 V); For test circuit see Figure 8. Symbol Parameter Conditions 25 C Typ tt transition time see Figure 6 VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V CPD power dissipation capacitance propagation delay per multiplexer; VI = GND to VCC 1ln to 1Y or 2ln to 2Y; see Figure 6 VCC = 4.5 V VCC = 5.0 V; CL = 15 pF Sn to nY; see Figure 6 VCC = 4.5 V VCC = 5.0 V; CL = 15 pF ten tdis tt CPD enable time disable time transition time power dissipation capacitance
tpd is the same as tPHL, tPLH. ten is the same as tPZH, tPZL. tdis is the same as tPHZ, tPLZ. tt is the same as tTHL, tTLH. CPD is used to determine the dynamic power dissipation (PD in W). PD = CPD x VCC2 x fi x N + (CL x VCC2 x fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in V; N = number of inputs switching; (CL x VCC2 x fo) = sum of outputs.
[5] [4]
-40 C to +85 C Max 75 15 13
-40 C to Unit +125 C Max 90 18 15 ns ns ns pF
Max 60 12 10 -
14 5 4 55
74HCT253 tpd
[1]
20 17 22 19
[2]
38 40 30 30 12 -
48 50 38 38 15
57
ns ns
60 45 45 18
ns ns ns ns ns pF
nOE to nY; VCC = 4.5 V; see Figure 7 nOE to nY; VCC = 4.5 V; see Figure 7 VCC = 4.5 V; see Figure 6 per multiplexer; VI = GND to VCC
14 13 5
[3]
[5]
55
[1] [2] [3] [4] [5]
74HC_HCT253_3
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(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 03 -- 22 April 2010
8 of 17
NXP Semiconductors
74HC253; 74HCT253
Dual 4-input multiplexer; 3-state
12. Waveforms
VI Sn, 1In, 2ln input GND tPHL VOH nY output VOL tTHL VM VM 10 % tTLH 001aal855 tPLH 90 % VM VM
Measurement points are given in Table 8. VOL and VOH are typical voltage output levels that occur with the output load.
Fig 6.
Propagation delays input (Sn, 1In, 2In) to output (nY) and output (nY) transition times
tr VI nOE input GND 10 % tPLZ output LOW-to-OFF OFF-to-LOW VCC 90 % VM
tf
tPZL
VM VOL tPHZ VOH 10 % tPZH 90 % VM GND outputs enabled outputs disabled outputs enabled
001aal856
output HIGH-to-OFF OFF-to-HIGH
Measurement points are given in Table 8. VOL and VOH are typical voltage output levels that occur with the output load.
Fig 7. Table 8. Type 74HC253
3-state output enable and disable times Measurement points Input VM 0.5VCC 1.3 V Output VM 0.5VCC 1.3 V
74HCT253
74HC_HCT253_3
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Product data sheet
Rev. 03 -- 22 April 2010
9 of 17
NXP Semiconductors
74HC253; 74HCT253
Dual 4-input multiplexer; 3-state
VI negative pulse 0V
tW 90 % VM 10 % tf tr tr tf 90 % VM 10 % tW VM VM
VI positive pulse 0V
VCC
VCC
G
VI
VO
RL
S1
DUT
RT CL
open
001aad983
Measurement points are given in Table 8 and test data is given in Table 9. Definitions test circuit: RT = Termination resistance should be equal to output impedance Zo of the pulse generator. CL = Load capacitance including jig and probe capacitance. RL = Load resistor.
Fig 8. Table 9. Type 74HC253
Test circuit for switching times Test data Input VI VCC 3V tr, tf 6 ns 6 ns Load CL 50 pF 50 pF RL 1 k 1 k Switch position tPHL, tPLH open open tPZH, tPHZ GND GND tPZL, tPLZ VCC VCC
74HCT253
74HC_HCT253_3
All information provided in this document is subject to legal disclaimers.
(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 03 -- 22 April 2010
10 of 17
NXP Semiconductors
74HC253; 74HCT253
Dual 4-input multiplexer; 3-state
13. Package outline
DIP16: plastic dual in-line package; 16 leads (300 mil) SOT38-4
D seating plane
ME
A2
A
L
A1
c Z e b1 b 16 9 b2 MH wM (e 1)
pin 1 index E
1
8
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 4.2 0.17 A1 min. 0.51 0.02 A2 max. 3.2 0.13 b 1.73 1.30 0.068 0.051 b1 0.53 0.38 0.021 0.015 b2 1.25 0.85 0.049 0.033 c 0.36 0.23 0.014 0.009 D (1) 19.50 18.55 0.77 0.73 E (1) 6.48 6.20 0.26 0.24 e 2.54 0.1 e1 7.62 0.3 L 3.60 3.05 0.14 0.12 ME 8.25 7.80 0.32 0.31 MH 10.0 8.3 0.39 0.33 w 0.254 0.01 Z (1) max. 0.76 0.03
Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. OUTLINE VERSION SOT38-4 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION
ISSUE DATE 95-01-14 03-02-13
Fig 9.
Package outline SOT38-4 (DIP16)
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74HC_HCT253_3
Product data sheet
Rev. 03 -- 22 April 2010
11 of 17
NXP Semiconductors
74HC253; 74HCT253
Dual 4-input multiplexer; 3-state
SO16: plastic small outline package; 16 leads; body width 3.9 mm
SOT109-1
D
E
A X
c y HE vMA
Z
16 9
Q A2 pin 1 index Lp
1 8
A1
(A 3)
A
L wM detail X
e
bp
0
2.5 scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 1.75 A1 0.25 0.10 A2 1.45 1.25 A3 0.25 0.01 bp 0.49 0.36 c 0.25 0.19 D (1) 10.0 9.8 E (1) 4.0 3.8 0.16 0.15 e 1.27 0.05 HE 6.2 5.8 L 1.05 Lp 1.0 0.4 0.039 0.016 Q 0.7 0.6 0.028 0.020 v 0.25 0.01 w 0.25 0.01 y 0.1 Z (1) 0.7 0.3
o
0.010 0.057 0.069 0.004 0.049
0.019 0.0100 0.39 0.014 0.0075 0.38
0.244 0.041 0.228
0.028 0.004 0.012
8 o 0
Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. OUTLINE VERSION SOT109-1 REFERENCES IEC 076E07 JEDEC MS-012 JEITA EUROPEAN PROJECTION
ISSUE DATE 99-12-27 03-02-19
Fig 10. Package outline SOT109-1 (SO16)
74HC_HCT253_3 All information provided in this document is subject to legal disclaimers. (c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 03 -- 22 April 2010
12 of 17
NXP Semiconductors
74HC253; 74HCT253
Dual 4-input multiplexer; 3-state
SSOP16: plastic shrink small outline package; 16 leads; body width 5.3 mm
SOT338-1
D
E
A X
c
y
HE
vM A
Z
16 9
Q A2 A1 pin 1 index Lp L
1 8
(A 3)
A
detail X wM
e
bp
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT338-1 REFERENCES IEC JEDEC MO-150 JEITA EUROPEAN PROJECTION A max. 2 A1 0.21 0.05 A2 1.80 1.65 A3 0.25 bp 0.38 0.25 c 0.20 0.09 D (1) 6.4 6.0 E (1) 5.4 5.2 e 0.65 HE 7.9 7.6 L 1.25 Lp 1.03 0.63 Q 0.9 0.7 v 0.2 w 0.13 y 0.1 Z (1) 1.00 0.55 8 o 0
o
ISSUE DATE 99-12-27 03-02-19
Fig 11. Package outline SOT338-1 (SSOP16)
74HC_HCT253_3 All information provided in this document is subject to legal disclaimers. (c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 03 -- 22 April 2010
13 of 17
NXP Semiconductors
74HC253; 74HCT253
Dual 4-input multiplexer; 3-state
14. Abbreviations
Table 10. Acronym CMOS DUT ESD HBM MM TTL Abbreviations Description Complementary Metal Oxide Semiconductor Device Under Test ElectroStatic Discharge Human Body Model Machine Model Transistor-Transistor Logic
15. Revision history
Table 11. Revision history Release date 20100422 Data sheet status Product data sheet Change notice Supersedes 74HC_HCT253_CNV_2 Document ID 74HC_HCT253_3 Modifications:
* *
The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. Legal texts have been adapted to the new company name where appropriate. Product specification -
74HC_HCT253_CNV_2
970828
74HC_HCT253_3
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(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 03 -- 22 April 2010
14 of 17
NXP Semiconductors
74HC253; 74HCT253
Dual 4-input multiplexer; 3-state
16. Legal information
16.1 Data sheet status
Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
[1] [2] [3]
Product status[3] Development Qualification Production
Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification.
Please consult the most recently issued document before initiating or completing a design. The term `short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
16.2 Definitions
Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification -- The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet.
suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on a weakness or default in the customer application/use or the application/use of customer's third party customer(s) (hereinafter both referred to as "Application"). It is customer's sole responsibility to check whether the NXP Semiconductors product is suitable and fit for the Application planned. Customer has to do all necessary testing for the Application in order to avoid a default of the Application and the product. NXP Semiconductors does not accept any liability in this respect. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer's general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control -- This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities.
16.3 Disclaimers
Limited warranty and liability -- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors' aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use in automotive applications -- This NXP Semiconductors product has been qualified for use in automotive applications. The product is not designed, authorized or warranted to be
74HC_HCT253_3
16.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.
All information provided in this document is subject to legal disclaimers.
(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 03 -- 22 April 2010
15 of 17
NXP Semiconductors
74HC253; 74HCT253
Dual 4-input multiplexer; 3-state
17. Contact information
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com
74HC_HCT253_3
All information provided in this document is subject to legal disclaimers.
(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 03 -- 22 April 2010
16 of 17
NXP Semiconductors
74HC253; 74HCT253
Dual 4-input multiplexer; 3-state
18. Contents
1 2 3 4 5 6 6.1 6.2 7 8 9 10 11 12 13 14 15 16 16.1 16.2 16.3 16.4 17 18 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 Functional description . . . . . . . . . . . . . . . . . . . 4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 Recommended operating conditions. . . . . . . . 5 Static characteristics. . . . . . . . . . . . . . . . . . . . . 5 Dynamic characteristics . . . . . . . . . . . . . . . . . . 7 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 14 Legal information. . . . . . . . . . . . . . . . . . . . . . . 15 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 15 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Contact information. . . . . . . . . . . . . . . . . . . . . 16 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'.
(c) NXP B.V. 2010.
All rights reserved.
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 22 April 2010 Document identifier: 74HC_HCT253_3

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